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BA01303

Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module

MitsubishiMitsubishi Electric Semiconductor

三菱電機三菱電機株式會社

BIS0130

HF(13.56MHz)

BalluffBalluff Korea Ltd.

巴魯夫巴魯夫集團

BMOD0130

56VMODULE

Maxwell

Maxwell Technologies

BURNDY_YF0130ID

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,1AWG,1.81L,TinPlated,Blue,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF0130IT

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,1AWG,1.81L,TinPlated,OliveGreen,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF0130IW

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,1AWG,1.81L,TinPlated,OliveGreen.

HUBBELL

HUBBELL INCORPORATED

CAB.0130

rohscompliant

TAOGLAS

Taoglas antenna solutions

CAB0130

TaoglasCableAssemblySMA(F)BulkheadStraighttoMCX(M)PlugStraightwith75mmRG-174cable

etc2List of Unclassifed Manufacturers

etc未分類制造商etc2未分類制造商

CAB0130

TaoglasCableAssemblySMA(F)BulkheadStraighttoMCX(M)PlugStraightwith75mmRG-174cable

TAOGLAS

Taoglas antenna solutions

CCL0130

CURRENTLIMITINGDIODE

DESCRIPTION TheCENTRALSEMICONDUCTORCCL0035Seriestypesaresiliconfieldeffectcurrentregulatordiodesdesignedforapplicationsrequiringaconstantcurrentoverawidevoltagerange.ThesedevicesaremanufacturedinthecosteffectiveDO-35doubleplugcase,whichprovidesmanybenefits

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CCL0130

CURRENTLIMITINGDIODE

CURRENTLIMITINGDIODE AvailableNon-RoHS(standard)orRoHScompliant(addPBFsuffix). Availableas“HR”(highreliability)screenedperMIL-PRF-19500,JANTXlevel.Add“HR”suffixtobasepartnumber.

DIGITRON

Digitron Semiconductors

CCLM0130

SURFACEMOUNTSILICONCURRENTLIMITINGDIODE

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CCLM0130

CURRENTLIMITINGDIODE

DESCRIPTION: TheCENTRALSEMICONDUCTORCCLM0035seriestypesaresiliconfieldeffectcurrentregulatordiodesdesignedforapplicationsrequiringaconstantcurrentoverawidevoltagerange.ThesedevicesaremanufacturedinthecosteffectiveSOD-80doubleplugcasewhichprovidesmanybenefit

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CDBER0130L

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0130L-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0130R

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0130R-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130

SMDSchottkyBarrierDiode

Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. P

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableper

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130L

SMDSchottkyBarrierDiode

Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark

COMCHIPComchip Technology

典琦典琦科技股份有限公司

詳細(xì)參數(shù)

  • 型號:

    BA0130

  • 制造商:

    MITSUBISHI

  • 制造商全稱:

    Mitsubishi Electric Semiconductor

  • 功能描述:

    Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module

供應(yīng)商型號品牌批號封裝庫存備注價格
MITSUBISHI
2017+
SMD
1585
只做原裝正品假一賠十!
詢價
MITSUBISHI
23+
NA
25060
只做進口原裝,終端工廠免費送樣
詢價
QORVO
24+
SMD
5000
QORVO“芯達集團”專營品牌原裝正品假一罰十
詢價
OK
ROHS
13352
一級代理 原裝正品假一罰十價格優(yōu)勢長期供貨
詢價
ROHM
16+
SOT-23-5
12000
鍏ㄦ柊鍘熻鐜拌揣/浠鋒牸鍙皥!
詢價
ROHM
20+
SOT-23-5
36800
原裝優(yōu)勢主營型號-可開原型號增稅票
詢價
ROHM
2023+
SOT-23-5
80000
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品
詢價
ROHM
24+
SOT-23-5
12000
原裝現(xiàn)貨假一賠十
詢價
ROHM/羅姆
22+
SOT-23-5
354000
詢價
ROHM/羅姆
2019+PB
SOT-23-5
12000
全新-特價大量供貨房間
詢價
更多BA0130供應(yīng)商 更新時間2025-1-17 16:50:00