TSSP-HA_V02中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

DESCRIPTION

The TSSP-HA is a plastic housing that provides support and

optical isolation between an emitter and a sensor for

reflective and beam-break sensor applications. A standard

lead bending, ST1, is designed for the TSSP-HA housing,

and may be ordered for both the TSSP4... and TSSP58...

series sensors.

FEATURES

? Withstands temperatures for wave soldering on

opposite side of PCB, or hand soldering

? For reflector and beam-break sensor applications

? 3 mm emitters

? Sensors with 2.54 mm pitch

? Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912