首頁 >TLS0022F/HEXBLUE>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
OriginalStrainReliefBushingAssemblyPliersDirectoryandJawSettingsGuide | HeycoHeyco. 海科 | Heyco | ||
OriginalStrainReliefBushingAssemblyPliersInstructionsandSpareParts | HeycoHeyco. ?？?/span> | Heyco | ||
DCPOWERJACKSPCBOARDANDPANELMOUNT | ADAM-TECHAdam Technologies, Inc. 亞當科技亞當科技股份有限公司 | ADAM-TECH | ||
6thGen.Intel?Core?i3/i5/i7ModularExpansionFanlessBoxPC Features ?6thGen.Intel?Core?i3/i5/i7mobileprocessor(BGA) ?Tripleindependentdisplay:VGA+HDMI+OptionalDisplay ?DDR4SO-DIMMmemorysupportupto32GB ?Option9-36Vpowermodulecompatiblewithall-in-oneordering ?Optionalmodulardesignfor2.5harddrivebays:internal/ | ADVANTECHAdvantech Co., Ltd. 研華科技研華科技（中國）有限公司 | ADVANTECH | ||
InductiveSensors BAWM18ME-UAC50B-BP03 Basicfeatures Approval/ConformityCE UKCA cULus WEEE BasicstandardIEC60947-5-2 IEC60947-5-7 | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團 | Balluff | ||
Reflectors,Fibers,Optics BFO18A-LGG-MZG-10-2 Basicfeatures BasicstandardIEC60947-5-2 ReferencebaseunitBFBM18M-011-P-S4 ScopeofdeliveryFiberoptics Version?2,standard | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團 | Balluff | ||
InductiveSensors BES516-300-S163-S4-D Basicfeatures Approval/ConformityCE UKCA cULus WEEE BasetypedeviationHousinglength BasicstandardIEC60947-5-2 | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團 | Balluff | ||
InductiveSensors BIPAD0-B014-01-EP00,2-S4-503 Basicfeatures ApplicationPositioning Approval/ConformityCE cURus WEEE BasicstandardIEC60947-5-2 IEC60947-5-7 | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團 | Balluff | ||
MagneticSensors BMF12M-PS-D-2-S4 Basicfeatures Approval/ConformityCE UKCA cULus WEEE BasicstandardIEC60947-5-2 PrincipleofoperationMagneticfieldsensor | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團 | Balluff | ||
UltrasonicSensors | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團 | Balluff |
| 供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
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