RYBS810中文資料順燁電子數(shù)據(jù)手冊PDF規(guī)格書

Features

● Surface mount bridge, small package;

● Ideal for printed circuit boards;

● Glass passivated chip junction;

● High forward current capability up to 8.0A;

● High surge current capability;

● High heat dissipation capability;

● Low profile package;

● Low forward voltage drop;

● Plastic package has Underwrites Laboratory

Flammability Classification 94V-0;