R5F211B4DSP-U0中文資料瑞薩數(shù)據(jù)手冊PDF規(guī)格書

Overview

These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/1B Group has on-chip data flash ROM (1 KB × 2 blocks). The difference between the R8C/1A Group and R8C/1B Group is only the presence or absence of data flash ROM. Their peripheral functions are the same.

Applications

Electric household appliances, office equipment, housing equipment (sensors, security systems), portable equipment, general industrial equipment, audio equipment, etc.