首頁 >QT703>規(guī)格書列表
零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
---|---|---|---|---|
Intel?Pentium?/Celeron?ApolloLakeSoCprocessorQsevenModule Features ?OnboardIntel?Pentium?/Celeron?SoCBGAprocessor?OnboardDDR3L1600/1333MHz4GB,upto8GB?2xSATAIII,6xUSB2.0,2xUSB3.0,3xPCIe2.0?DualChannel18/24-bitLVDS+HDMI?SupportseMMC5.0,SDcard(SDIO3.0)?QsevenFormFactorRev.2.1Compliant?StandardTemperat | BCM bcm advanced search | BCM | ||
HIGHREPEATABILITY,TO-5RELAYSDPDT DESCRIPTION TheultraminiatureRF700andRF703relaysare designedtoprovideimprovedRFsignalswitching repeatabilityoverthefrequencyrange.Theserelaysare engineeredforuseinRFattenuator,RFswitchmatrices, ATEandotherapplicationsthatrequiredependable highfrequencysigna | TELEDYNETeledyne Technologies Incorporated 華特力科 | TELEDYNE | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Halogenfree,EnvironmentalfriendlyPackageincludeConformitytoRoHSDirective. ?UltrasmallPackage(0.6mm×0.3mmSizeleadlesstype) | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS |
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|