訂購數(shù)量 | 價(jià)格 |
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1+ |
MLG0603S1N2BT000_TDK/TDK株式會(huì)社_Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for Highfrequency.潤(rùn)聯(lián)芯城
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- 規(guī)格書下載
原廠料號(hào):MLG0603S1N2BT000品牌:TDK
只做原裝正品
- 芯片型號(hào):
MLG0603S1N2BT000
- 規(guī)格書:
- 企業(yè)簡(jiǎn)稱:
TDK【TDK株式會(huì)社】詳情
- 廠商全稱:
TDK Corporation
- 中文名稱:
東電化(中國(guó))投資有限公司
- 內(nèi)容頁數(shù):
14 頁
- 文件大小:
152.61 kb
- 資料說明:
Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for Highfrequency.
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