首頁(yè) >MLA00340PWPR>規(guī)格書(shū)列表
| 零件編號(hào) | 下載 訂購(gòu) | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
SMDSchottkyBarrierDiode Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. -AEC-Q101Qualified. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features IO=30mA VR=40V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowcapacitance. -Majoritycarrierconduction -Lead-freedevice | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Io=30mA VR=40Volts RoHSDevice Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-7 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=30mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderable | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=30mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowcapacitance. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-75 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=30mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=30mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderablep | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=30mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solder | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=30mA VR=40Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:12063(3216)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method20 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode ReverseVoltage:30Volts ForwardCurrent:30mA Features: ?SmallSurfaceMountingType ?HighReliability ?LowReverseCurrentandLowForwardVoltage MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indicatedbycathod | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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