MBRB2060CTG_V01中文資料安森美半導體數據手冊PDF規(guī)格書

These state-of-the-art devices employ the use of the Schottky Barrier

principle with a platinum barrier metal.

Features

? Package Designed for Power Surface Mount Applications (D2PAK)

? Center-Tap Configuration (D2PAK)

? Guardring for Stress Protection

? Low Forward Voltage

? 175°C Operating Junction Temperature

? Epoxy Meets UL 94 V?0 @ 0.125 in

? Short Heat Sink Tab Manufactured ? Not Sheared (D2PAK)

? Similar in Size to Industry Standard TO?220 Package

? NRVBB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC?Q101

Qualified and PPAP Capable

? These are Pb?Free Devices

Mechanical Characteristics:

? Case: Epoxy, Molded, Epoxy Meets UL 94 V?0

? Weight: 1.7 Grams (Approximately) ? D2PAK,

1.9 Grams (Approximately) ? TO?220

? Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

? Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds (D2PAK)

? Device Meets MSL1 Requirements (D2PAK)

? ESD Ratings:

? Machine Model = C (> 400 V)

? Human Body Model = 3B (> 8000 V)