首頁(yè) >MAX32625MBED>規(guī)格書(shū)列表
| 零件編號(hào) | 下載 訂購(gòu) | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
Board-GanizerEnclosureKit | BUD Bud Industries, Inc. | BUD | ||
High-EfficiencyMicrocontrollerforWearableDevices GeneralDescription TheMAX32625/MAX32626isanARM?Cortex?-M4F32-bitmicrocontrollerwithanunconnectedpointunit,idealfortheemergingcategoryofwearablemedicalandfitnessapplications.Thearchitecturecombinesultra-lowpower,high-efficiencysignalprocessingfunctionalityandease | MaximMaxim Integrated Products 美信美信半導(dǎo)體 | Maxim | ||
MAX32625PICOApplicationPlatform | MaximMaxim Integrated Products 美信美信半導(dǎo)體 | Maxim | ||
High-EfficiencyMicrocontrollerforWearableDevices GeneralDescription TheMAX32625/MAX32626isanARM?Cortex?-M4F32-bitmicrocontrollerwithanunconnectedpointunit,idealfortheemergingcategoryofwearablemedicalandfitnessapplications.Thearchitecturecombinesultra-lowpower,high-efficiencysignalprocessingfunctionalityandease | MaximMaxim Integrated Products 美信美信半導(dǎo)體 | Maxim | ||
High-EfficiencyMicrocontrollerforWearableDevices GeneralDescription TheMAX32625/MAX32626isanARM?Cortex?-M4F32-bitmicrocontrollerwithanunconnectedpointunit,idealfortheemergingcategoryofwearablemedicalandfitnessapplications.Thearchitecturecombinesultra-lowpower,high-efficiencysignalprocessingfunctionalityandease | MaximMaxim Integrated Products 美信美信半導(dǎo)體 | Maxim | ||
MAX32625PICOApplicationPlatform | MaximMaxim Integrated Products 美信美信半導(dǎo)體 | Maxim |
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
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