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M541中文資料MA-COM數(shù)據(jù)手冊(cè)PDF規(guī)格書

M541
廠商型號(hào)

M541

功能描述

Bonding, Handling, and Mounting Procedures for Chip Diode Devices

文件大小

231.13 Kbytes

頁(yè)面數(shù)量

9 頁(yè)

生產(chǎn)廠商 M/A-COM Technology Solutions, Inc.
企業(yè)簡(jiǎn)稱

MA-COM

中文名稱

M/A-COM Technology Solutions, Inc.官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-5 22:58:00

M541規(guī)格書詳情

Discussion

Chip Diode devices for use in integrated circuits and hybrid integrated circuits have proliferated in the last few years. Today circuit designer is faced with a multiplicity of alternatives in the involving tradeoffs of particular advantages and disadvantages. The obvious advantages in the use of chip diodes in hybrid integrated circuit applications are their very small size and potentially lower cost. Small size and simplicity of structure give the benefit of minimal parasitics, but as the size of the diode becomes smaller, handling and production problems increase. By outlining our conclusions, we hope to help the designer overcome some of the difficulties encountered when using chips in MIC applications. M/A-COM Tech manufactures a large selection of chip and packaged diodes for hybrid integrated circuits. Obviously not all diode types are available in all configurations. Characteristics such as breakdown voltage or capacitance may limit the size of the chip or its form.

產(chǎn)品屬性

  • 型號(hào):

    M541

  • 制造商:

    MITSUBISHI

  • 制造商全稱:

    Mitsubishi Electric Semiconductor

  • 功能描述:

    EARTH LEAKAGE CURRENT DETECTOR

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