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KTE7001中文資料芯凱電子數(shù)據(jù)手冊PDF規(guī)格書

KTE7001
廠商型號

KTE7001

功能描述

15W Wireless Power Receiver for WPC/Qi BPP/EPP

文件大小

207.24 Kbytes

頁面數(shù)量

2

生產(chǎn)廠商 Kinetic Technologies.
企業(yè)簡稱

KINETIC芯凱電子

中文名稱

芯凱電子科技(上海)有限公司官網(wǎng)

原廠標識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-2-2 8:00:00

KTE7001規(guī)格書詳情

Features

? Single-Chip Solution for 15-Watt wireless power

? WPC/Qi v1.2.4 and v1.3 Standards Compliant

? 98% Peak Efficiency LDO mode from Coil to 12VOUT

? Full Synchronous Rectification with Low-RDSON

? LDO Mode or Pass-Through Mode configurable

? 5V/9V/12V output at up to 1.5A peak output current

? Pass-Through Mode for increased efficiency

? Short-circuit protection and current limiting

? Embedded Microcontroller and OTP Memory

? Configurable Foreign Object Detection (FOD)

? Standard Firmware with optional external resistor

configuration of FOD operating parameters

? Optional I2C connection for monitoring/configuration

and system performance analysis

? Device Enable control pin for extremely low power

consumption while in disabled mode

? Optional open-drain Interrupt output pin

? Proprietary, robust internal Over-Voltage Protection

? Without any external “Sink” resistor or other devices

? Optional external NTC Over-Temperature Protection

? -40°C to 85°C operating temperature range

? 52-bump WLCSP 2.66 x 3.90mm (0.4mm pitch)

Brief Description

The KTE7001 is a single-chip 15-Watt wireless power

receiver that conforms to WPC/Qi standards v1.2.4 and

v1.3 Extended Power Profile (EPP) specifications. A

wireless power receiver provides regulated DC output

power derived from AC power that is magnetically

coupled into a connected wireless power receiver coil.

The KTE7001 integrates a full synchronous rectifier and

LDO to efficiently convert the wireless AC power into up

to 12V DC regulated power at up to 1.5A. The

embedded microcontroller with firmware and OTP

memory provides system monitoring, protection, and

communications back to the power transmitter.

The KTE7001 is packaged in an advanced, fully “green”

compliant, 2.66mm x 3.90mm, 52-bump Wafer-Level

Chip-Scale Package (6x9 WLCSP).

Applications

? Mobile Internet Devices, IoT, Accessories

? Battery Powered Medical, Industrial, Consumer

? Wireless Headsets, Headphones, Earbuds

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