首頁(yè) >IMX662-AAQR-C>規(guī)格書(shū)列表
| 零件編號(hào) | 下載 訂購(gòu) | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
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HIGHVOLTAGEDARLINGTONOUTPUTOPTICALLYCOUPLEDISOLATOR | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | ETC1 | ||
HIGHVOLTAGEDARLINGTONOUTPUTOPTICALLYCOUPLEDISOLATOR | ISOCOMISOCOM COMPONENTS 英國(guó)安數(shù)光 | ISOCOM | ||
HIGHVOLTAGEDARLINGTONOUTPUTOPTICALLYCOUPLEDISOLATOR | ISOCOMISOCOM COMPONENTS 英國(guó)安數(shù)光 | ISOCOM | ||
AC/DCSecondary-SideSynchronousRectificationandRapidCharge | DialogDialog Semiconductor 戴樂(lè)格 | Dialog | ||
AC/DCSecondary-SideSynchronousRectificationandRapidChargeTMInterfaceControllerforQualcomm?QuickCharge?3.0 1Description TheiW662isanAC/DCsecondary-sidecombocontrollerforQualcomm?QuickChargeTM3.0(QC3.0)whichincludes USBinterface,secondary-to-primarycommunicationandsynchronousrectificationfunctionsinasingleIC. TheiW662residesonthesecondarysideofanAC/DCpowersupply | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
EPITAXIALPLANARNPNTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式會(huì)社 | KEC | ||
EPITAXIALPLANARNPNTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式會(huì)社 | KEC | ||
CMOSDualOperationalAmplifier | NSCNational Semiconductor (TI) 美國(guó)國(guó)家半導(dǎo)體美國(guó)國(guó)家半導(dǎo)體公司 | NSC | ||
LMC662CMOSDualOperationalAmplifier | TITexas Instruments 德州儀器美國(guó)德州儀器公司 | TI | ||
CMOSDualOperationalAmplifier | NSCNational Semiconductor (TI) 美國(guó)國(guó)家半導(dǎo)體美國(guó)國(guó)家半導(dǎo)體公司 | NSC |
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