首頁 >H11A1XG>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
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VDEAPPROVEDTRANSISTOROUTPUTOPTOCOUPLER [GENERALINSTRUMENT] DESCRIPTION TheH11A1isaphototransistor-typeopticallycoupledisolator.AninfraredemittingdiodemanufacturedfromspeciallygrowngalliumarsenideisselectivelycoupledwithanNPNsiliconphototransistorinastandardplasticsix-pindual-in-linepackage. FEATURES | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | ETC1 | ||
SILICONEPITAXIALPLANERZENERDIODES forstabilizedpowersupply Features ?Lowleakage,lowzenerimpedanceandmaximumpowerdissipationof500mWareideallysuitedforstabilizedpowersupply,etc. ?Widespectrumfrom1.6Vthrough38Vofzenervoltageprovideflexibleapplication. | SEMTECH_ELECSEMTECH ELECTRONICS LTD. 先之科半導(dǎo)體先之科半導(dǎo)體科技（東莞）有限公司 | SEMTECH_ELEC | ||
Glass-EncapsulateDiodes | HOTTECHGuangdong Hottech Co. Ltd. 合科泰深圳市合科泰電子有限公司 | HOTTECH | ||
SiliconEpitaxialPlanarZenerDiodeforStabilizedPowerSupply Features ?Lowleakage,lowzenerimpedanceandmaximumpowerdissipationof500mWareideallysuitedforstabilizedpowersupply,etc. ?Widespectrumfrom1.6Vthrough38Vofzenervoltageprovideflexibleapplication. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconEpitaxialPlanarZenerDiodeforStabilizedPowerSupply Features ?Lowleakage,lowzenerimpedanceandmaximumpowerdissipationof500mWareideallysuitedforstabilizedpowersupply,etc. ?Widespectrumfrom1.6Vthrough38Vofzenervoltageprovideflexibleapplication. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconEpitaxialPlanarZenerDiodeforStabilizedPowerSupply | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconPlanarZenerDiodeforLowNoiseApplication | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
PowerTransducerSeriesL-UNIT | MSYSTEMM-System Co.,Ltd. 愛模愛模系統(tǒng)有限公司 | MSYSTEM | ||
PowerTransducerSeriesL-UNIT | MSYSTEMM-System Co.,Ltd. 愛模愛模系統(tǒng)有限公司 | MSYSTEM | ||
SiliconPlanarZenerDiodeforStabilizedPowerSupply Features ?Lowleakage,lowzenerimpedanceandmaximumpowerdissipationof500mW. ?Widespectrumfrom1.9Vthrough38Vofzenervoltageprovideflexibleapplication. ?LLDPackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS |
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