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HSB276AS

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB276AS

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSB276AS

SiliconSchottkyBarrierDiode

Features ?Highforwardcurrent,Lowcapacitance. ?HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly.

KEXINGuangdong Kexin Industrial Co.,Ltd

科信電子廣東科信實業(yè)有限公司

HSB276AYP

SILICONSCHOTTKYBARRIERDIODEFORHIGHSPEEDSWITCHING

Features ?Highforwardcurrent,Lowcapacitance. ?CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB276AYP

SiliconSchottkyBarrierDiodeforHighSpeedSwitching

Features ?Highforwardcurrent,Lowcapacitance. ?CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSB276S

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB276S

SiliconSchottkyBarrierDiodeforDetectorandMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSB276S

SiliconSchottkyBarrierDiode

Features ●Highforwardcurrent,Lowcapacitance. ●HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ●CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

KEXINGuangdong Kexin Industrial Co.,Ltd

科信電子廣東科信實業(yè)有限公司

HSC276

SiliconSchottkyBarrierDiodeforMixer

Features ?Highforwardcurrent,Lowcapacitance. ?UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

HitachiHitachi Semiconductor

日立日立公司

HSC276

HSC276_03

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

替換型號

供應(yīng)商型號品牌批號封裝庫存備注價格
24+
N/A
75000
一級代理-主營優(yōu)勢-實惠價格-不悔選擇
 詢價
TFT
1748
0805-
4390
詢價
SULLINS
19+
7650
詢價
SULLINS
2022+
7650
原廠原裝,假一罰十
 詢價
SULLINS
23+
10000
原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種
 詢價
N/A
專業(yè)模塊
MODULE
8513
模塊原裝主營-可開原型號增稅票
 詢價
N/A
24+
MODULE
2100
公司大量全新現(xiàn)貨 隨時可以發(fā)貨
 詢價
N/A
23+
MODULE
7300
專注配單,只做原裝進口現(xiàn)貨
 詢價
N/A
23+
MODULE
7300
專注配單,只做原裝進口現(xiàn)貨
 詢價
NULL
23+
原廠原裝
1001
全新原裝現(xiàn)貨
 詢價
更多GEC-276供應(yīng)商 更新時間2025-2-18 11:06:00

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