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FF600R12IE4分立半導(dǎo)體產(chǎn)品的晶體管-IGBT-模塊規(guī)格書(shū)PDF中文資料
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廠商型號(hào) |
FF600R12IE4 |
參數(shù)屬性 | FF600R12IE4 封裝/外殼為模塊;包裝為托盤(pán);類(lèi)別為分立半導(dǎo)體產(chǎn)品的晶體管-IGBT-模塊;產(chǎn)品描述:IGBT MOD 1200V 600A 3350W |
功能描述 | E v a l u a t i o n D r i v e r B o a r d f o r 1 2 0 0 V PrimePACK? |
封裝外殼 | 模塊 |
文件大小 |
1.06934 Mbytes |
頁(yè)面數(shù)量 |
30 頁(yè) |
生產(chǎn)廠商 | Infineon Technologies AG |
企業(yè)簡(jiǎn)稱(chēng) |
Infineon【英飛凌】 |
中文名稱(chēng) | 英飛凌科技股份公司官網(wǎng) |
原廠標(biāo)識(shí) | ![]() |
數(shù)據(jù)手冊(cè) | |
更新時(shí)間 | 2025-2-21 18:53:00 |
人工找貨 | FF600R12IE4價(jià)格和庫(kù)存,歡迎聯(lián)系客服免費(fèi)人工找貨 |
FF600R12IE4規(guī)格書(shū)詳情
FF600R12IE4屬于分立半導(dǎo)體產(chǎn)品的晶體管-IGBT-模塊。由英飛凌科技股份公司制造生產(chǎn)的FF600R12IE4晶體管 - IGBT - 模塊絕緣柵雙極晶體管 (IGBT) 是三端功率半導(dǎo)體器件,主要用作電子開(kāi)關(guān),兼具高效率和快速切換優(yōu)點(diǎn)。作為模塊,IGBT 配置為非對(duì)稱(chēng)式橋; 升壓、降壓和制動(dòng)斬波器;全橋、三電平和三相逆變器。有些器件內(nèi)置了用于監(jiān)控溫度的 NTC 熱敏電阻。IGBT 模塊可根據(jù)最大功率、集電極電流、集射擊穿電壓和配置進(jìn)行區(qū)分。
1 Introduction
The 2ED250E12-F evaluation driver board shown in Fig. 1 was developed to support customers during their
first design steps with the 1200V PrimePACK? IGBT module. The evaluation driver board is a fully
functional IGBT module driver where two 1ED020I12-F driver IC process control and feedback signals and
provide galvanic insulation. An embedded isolated DC/DC converter supplies gate drive power to both IGBTs
of a halbridge configuration.
The 2ED250E12-F Evaluation driver boards are available from Infineon in small quantities. Functions and
properties of these parts are described in the datasheet chapter of this document whereas the remaining
paragraphs provide information intended to enable the customer to copy, modify and qualify the design for
production according to his specific requirements.
The design of the 2ED250E12-F was performed with respect to the environmental conditions described as
design target in this document. The requirements for leadfree reflow soldering have been considered when
components were selected. The design was tested as described in this documentation but not qualified
regarding manufacturing and operation in the whole operating ambient temperature range or lifetime.
The boards provided by Infineon are subjected to functional testing only.
Due to their purpose evaluation boards are not subjected to the same procedures regarding Returned
Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular products.
See Legal Disclaimer and Warnings for further restrictions on Infineon warranty and liability.
2 Design features
Electric features of the evaluation board and mechanical dimensions including interface connections are presented in following sections.
2.1 Main features
The 2ED250E12-F Evaluation Driver Board offers the following features:
? Dual channel IGBT driver utilising the 1ED020I12-F1 driver IC
? Electrically and mechanically suitable for PrimePACK? modules 1200V family
? Integrated isolated DC/DC power supply
? Integrated protection against DC/DC power supply short circuit
? Under Voltage Lockout
? Positive logic with CMOS logic level (5V) for PWM and Fault signals. Can be converted to negative logic
? Separated fault output and ready signal for Top and Bottom IGBT
? Separated ground potential for DC/DC power supply and input logic
? Different gate resistor values for turning-on and -off are possible
? IGBTs are protected against temporary VCE overvoltages during turn-off (Active Clamping)
? Diodes for IGBT desaturation monitoring implemented (short circuit protection)
? All components, except DC/DC transformer, are surface mount devices (SMD) with lead free 260°C
soldering profile
? PCB is designed to fulfil the requirements of IEC61800-5-1, pollution degree 2, overvoltage category III
產(chǎn)品屬性
更多- 產(chǎn)品編號(hào):
FF600R12IE4PNOSA1
- 制造商:
Infineon Technologies
- 類(lèi)別:
分立半導(dǎo)體產(chǎn)品 > 晶體管 - IGBT - 模塊
- 系列:
PrimePACK?2
- 包裝:
托盤(pán)
- IGBT 類(lèi)型:
溝槽型場(chǎng)截止
- 配置:
半橋
- 不同?Vge、Ic 時(shí)?Vce(on)(最大值):
2.05V @ 15V,600A
- 輸入:
標(biāo)準(zhǔn)
- NTC 熱敏電阻:
是
- 工作溫度:
-40°C ~ 150°C
- 安裝類(lèi)型:
底座安裝
- 封裝/外殼:
模塊
- 供應(yīng)商器件封裝:
模塊
- 描述:
IGBT MOD 1200V 600A 3350W
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
原裝 |
24+ |
MODULE |
13859 |
熱賣(mài)原裝現(xiàn)貨 |
詢(xún)價(jià) | ||
Infineon Technologies |
24+ |
Module |
1262 |
原廠原裝正品現(xiàn)貨,代理渠道,支持訂貨!!! |
詢(xún)價(jià) | ||
Infineon(英飛凌) |
23+ |
6000 |
誠(chéng)信服務(wù),絕對(duì)原裝原盤(pán) |
詢(xún)價(jià) | |||
Infineon/英飛凌 |
1950+ |
980 |
只做原裝正品現(xiàn)貨!或訂貨假一賠十! |
詢(xún)價(jià) | |||
INFINEON/英飛凌 |
19+ |
MODULE |
200 |
原裝現(xiàn)貨支持BOM配單服務(wù) |
詢(xún)價(jià) | ||
INFINEON |
MODULE |
7562 |
一級(jí)代理 原裝正品假一罰十 價(jià)格優(yōu)勢(shì) 實(shí)單帶接受價(jià) |
詢(xún)價(jià) | |||
INFINEON/英飛凌 |
22+ |
MODULE |
25000 |
只做原裝進(jìn)口現(xiàn)貨,專(zhuān)注配單 |
詢(xún)價(jià) | ||
Infineon(英飛凌) |
23+ |
標(biāo)準(zhǔn)封裝 |
7000 |
原廠原裝現(xiàn)貨訂貨價(jià)格優(yōu)勢(shì)終端BOM表可配單提供樣品 |
詢(xún)價(jià) | ||
INFINEON |
22+ |
NA |
2000 |
全新原裝品牌專(zhuān)營(yíng) |
詢(xún)價(jià) | ||
INFINEON |
24+ |
MODULE |
2100 |
公司大量全新現(xiàn)貨 隨時(shí)可以發(fā)貨 |
詢(xún)價(jià) |