EVAL-ADUCM410QSP1Z開發(fā)板套件編程器的評(píng)估板-嵌入式-MCUDSP規(guī)格書PDF中文資料

EVAL-ADUCM410QSP1Z屬于開發(fā)板套件編程器的評(píng)估板-嵌入式-MCUDSP。由亞德諾半導(dǎo)體技術(shù)有限公司制造生產(chǎn)的EVAL-ADUCM410QSP1Z評(píng)估板 - 嵌入式 - MCU，DSP該系列產(chǎn)品提供了一種方便的方法，在經(jīng)過驗(yàn)證的硬件實(shí)施環(huán)境中評(píng)估微控制器、微處理器和數(shù)字信號(hào)處理器元器件的性能或特性。所包括的產(chǎn)品因預(yù)期用例各異，范圍可能從旨在方便評(píng)估的未填充 PCB 到各種微控制器系列，再到具有廣泛外設(shè)支持的單板計(jì)算機(jī)。

GENERAL DESCRIPTION

The ADuCM410 is a fully integrated, single package device that includes high performance analog peripherals together with digital peripherals (controlled by a 160 MHz Arm? Cortex?- M33 processor) and integrated flash for code and data.

FEATURES

Analog input/output

Multichannel, 16-bit, 2 MSPS ADC

Up to 16 external channels

On-chip die temperature monitor

4 power monitor channels

4 PGA/TIA channels supporting voltage and current

measurements

Fully differential and single-ended modes

0 V to VREF analog input range

12-bit voltage output DACs

8× 0 V to 2.5 V, 1 k? load

4× 0 V to 2.5 V, 2.5 k? load

On-chip low drift voltage reference, 1.25 V or 2.5 V

Buffered 1.25 V or 2.5 V output

4 voltage comparators

Microcontroller

32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU

Serial wire port supports code download and debug

Clocking options

16 MHz on-chip oscillator

160 MHz PLL output with programmable divider

External clock source

Memory

2× 512 kB independent Flash/EE memories

10,000-cycle Flash/EE endurance

20-year Flash/EE retention

128 kB SRAM with ECC

Software triggered, in circuit reprogrammability via MDIO or I2C

On-chip peripherals

2× UART, 3× SPI, 3× I2C serial input/output

Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs

MDIO slave up to 10 MHz

5 general-purpose timers

Wake-up timer (WUTs)

Watchdog timers (WDTs)

32-element PLA

16-bit PWM

10 external Interrupts

Power

Multiple supplies: 3.3 V for voltage DACs and ADCs, and

3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs

Flexible operating modes for low power applications

Packages and temperature range

5 mm × 5 mm, 81-ball CSP_BGA and 3.46 mm × 3.46 mm

64-ball WLCSP

BGA package uses ULA molding compounds

Fully specified for ?40°C to +105°C operation

Tools

Low cost quick start development system

Full third-party support

APPLICATIONS

Optical networking 100 Gbps/200 Gbps/400 Gbps and

higher frequency modules

Industrial control, automation, and instrumentation systems