DS310W中文資料淄博圣諾電子數(shù)據(jù)手冊(cè)PDF規(guī)格書
DS310W規(guī)格書詳情
Features
● Schottky Barrier Chip
● Ideally Suited for Automatic Assembly
● Low Power Loss, High Efficiency
● Surge Overload Rating to 2 0A Peak
● For Use in Low Voltage Application
● Guard Ring Die Construction
● Plastic Case Material has UL Flammability
Classification Rating 94V-O
Mechanical Data
● Weight: 0.01 grams (approx.)
● Case: SOD-123, Molded Plastic
● Terminals: Solder Plated, Solderable per MIL-STD-750, Method 2026
● Polarity: Cathode Band or Cathode Notch
● Marking: Type Number
● Lead Free: For RoHS / Lead Free Version
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
JINGDAO/晶導(dǎo)微 |
23+ |
NA/ |
3260 |
原裝現(xiàn)貨,當(dāng)天可交貨,原型號(hào)開票 |
詢價(jià) | ||
INTEL |
23+ |
BGA |
6137 |
詢價(jià) | |||
JD晶導(dǎo)微 |
SOD-123FL |
68900 |
原包原標(biāo)簽100%進(jìn)口原裝常備現(xiàn)貨! |
詢價(jià) | |||
DALLAS |
24+ |
BGA |
9 |
詢價(jià) | |||
DALLAS |
19+ |
BGA |
256800 |
原廠代理渠道,每一顆芯片都可追溯原廠； |
詢價(jià) | ||
DALLAS |
22+ |
BGA256 |
5000 |
全新原裝現(xiàn)貨!價(jià)格優(yōu)惠!可長(zhǎng)期 |
詢價(jià) | ||
CEC |
24+ |
SMD |
10 |
C29-晶振 |
詢價(jià) | ||
DallasLogicCorporation |
21+ |
BGA |
12588 |
原裝正品,量大可定 |
詢價(jià) | ||
DALLAS |
23+ |
DIP-20 |
5000 |
原裝正品,假一罰十 |
詢價(jià) | ||
24+ |
SOD-123FL |
66530 |
全新原裝現(xiàn)貨/假一罰百! |
詢價(jià) |
