零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
1ABRIDGERECTIFIERS | FRONTIER Frontier Electronics | FRONTIER | ||
SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1.0AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS DESCRIPTION: TheCENTRALSEMICONDUCTOR1.0AmpSurfaceMountSiliconRectifierisahighquality,wellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplications.Toorderdeviceson12mmTapeandReel(3000 | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTHIGHVOLTAGERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTHIGHVOLTAGERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
FLYOVER?QSFPCABLEASSEMBLIES | Samtec Samtec, Inc | Samtec |
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
Central Semi |
2022+ |
原廠原包裝 |
8600 |
全新原裝 支持表配單 中國著名電子元器件獨(dú)立分銷 |
詢價 | ||
COMCHIP |
23+ |
NA |
271 |
專做原裝正品,假一罰百! |
詢價 | ||
COMCHIP |
新 |
1700 |
全新原裝 貨期兩周 |
詢價 | |||
COMCHIP/典琦科技 |
23+ |
SMA |
879448 |
原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種 |
詢價 | ||
Comchip |
16+ |
DO-214ACSMA |
92000 |
鍏ㄦ柊鍘熻鐜拌揣/浠鋒牸鍙皥! |
詢價 | ||
COMCHIP |
1809+ |
DO-214 |
6675 |
就找我吧!--邀您體驗(yàn)愉快問購元件! |
詢價 | ||
Comchip |
22+ |
NA |
75 |
加我QQ或微信咨詢更多詳細(xì)信息, |
詢價 | ||
24+ |
N/A |
46000 |
一級代理-主營優(yōu)勢-實(shí)惠價格-不悔選擇 |
詢價 | |||
COMCHIP |
2016+ |
DO-214AC |
6523 |
只做進(jìn)口原裝現(xiàn)貨!假一賠十! |
詢價 | ||
COMCHIP |
2023+ |
DO-214AC |
80000 |
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品 |
詢價 |
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