首頁(yè) >CBRLD1-04BK>規(guī)格書(shū)列表
零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1.0AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS DESCRIPTION: TheCENTRALSEMICONDUCTOR1.0AmpSurfaceMountSiliconRectifierisahighquality,wellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplications.Toorderdeviceson12mmTapeandReel(3000 | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTHIGHVOLTAGERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTHIGHVOLTAGERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
FLYOVER?QSFPCABLEASSEMBLIES | Samtec Samtec, Inc | Samtec | ||
FLYOVER?QSFPCABLEASSEMBLIES | Samtec Samtec, Inc | Samtec | ||
(2.54mm).100 | Samtec Samtec, Inc | Samtec | ||
(2.54mm).100 | Samtec Samtec, Inc | Samtec |
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
Central Semiconductor Corp |
24+ |
4-SMD 鷗翼 |
9350 |
獨(dú)立分銷(xiāo)商 公司只做原裝 誠(chéng)心經(jīng)營(yíng) 免費(fèi)試樣正品保證 |
詢(xún)價(jià) | ||
Central Semiconductor Corp |
22+ |
4LPDIP |
9000 |
原廠渠道,現(xiàn)貨配單 |
詢(xún)價(jià) | ||
Central Semiconductor Corp |
21+ |
4LPDIP |
13880 |
公司只售原裝,支持實(shí)單 |
詢(xún)價(jià) | ||
Central Semiconductor Corp |
23+ |
4LPDIP |
9000 |
原裝正品,支持實(shí)單 |
詢(xún)價(jià) | ||
Central |
16+ |
LPDIP |
85000 |
鍏ㄦ柊鍘熻鐜拌揣/浠鋒牸鍙皥! |
詢(xún)價(jià) | ||
Central |
20+ |
LPDIP |
36800 |
原裝優(yōu)勢(shì)主營(yíng)型號(hào)-可開(kāi)原型號(hào)增稅票 |
詢(xún)價(jià) | ||
Central |
2023+ |
LPDIP |
80000 |
一級(jí)代理/分銷(xiāo)渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品 |
詢(xún)價(jià) | ||
CENTRAL |
1809+ |
DIP-4 |
3675 |
就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件! |
詢(xún)價(jià) | ||
Central |
22+ |
NA |
3881 |
加我QQ或微信咨詢(xún)更多詳細(xì)信息, |
詢(xún)價(jià) | ||
CENTRAL |
22+ |
LPDIP |
354000 |
詢(xún)價(jià) |
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