BYX135GL中文資料飛利浦?jǐn)?shù)據(jù)手冊PDF規(guī)格書
BYX135GL規(guī)格書詳情
DESCRIPTION
Rugged glass package, using a high temperature alloyed construction.
The SOD119AD is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.
FEATURES
? Glass passivated
? High maximum operating temperature
? Low leakage current
? Excellent stability
? Guaranteed avalanche energy absorption capability.
APPLICATIONS
? Car ignition systems
? Automotive applications with extreme temperature requirements.
產(chǎn)品屬性
- 型號：
BYX135GL
- 制造商：
PHILIPS
- 制造商全稱：
NXP Semiconductors
- 功能描述：
High-voltage car ignition diode
