零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
BUZ355 | SIPMOS Power Transistor (N channel Enhancement mode Avalanche-rated) SIPMOS?PowerTransistor ?Nchannel ?Enhancementmode ?Avalanche-rated | SIEMENSSiemens Semiconductor Group 西門子德國西門子股份公司 | SIEMENS | |
BUZ355 | Enhancement mode Nchannel Enhancementmode Avalanche-rated | NJSEMINew Jersey Semi-Conductor Products, Inc. 新澤西半導(dǎo)體新澤西半導(dǎo)體產(chǎn)品股份有限公司 | NJSEMI | |
BUZ355 | isc N-Channel MOSFET Transistor FEATURES ·DrainCurrent:ID=6.0A@TC=25℃ ·DrainSourceVoltage :VDSS=800V(Min) ·StaticDrain-SourceOn-Resistance :RDS(on)=1.5Ω(Max)@VGS=10V ·100avalanchetested ·MinimumLot-to-Lotvariationsforrobustdevice performanceandreliableoperation DESCRIPTION ·motordrive, | ISCInchange Semiconductor Company Limited 無錫固電無錫固電半導(dǎo)體股份有限公司 | ISC | |
100V/100mASURFACEMOUNTSWITCHINGDIODE | CYSTEKECCystech Electonics Corp. 全宇昕科技全宇昕科技股份有限公司 | CYSTEKEC | ||
80V/100mASURFACEMOUNTSWITCHINGDIODE | CYSTEKECCystech Electonics Corp. 全宇昕科技全宇昕科技股份有限公司 | CYSTEKEC | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Highspeedswitching. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,m | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode RoHSDevice HalogenFree Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplas | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage, moldedplas | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage, moldedplas | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode RoHSDevice HalogenFree Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplas | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode Features Designedformountingonsmallsurface. Highspeedswitching. Highmountingcapability,strongsurgewithstand,highreliability. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
HighSpeed Features Designedformountingonsmallsurface. Highspeedswitching. Highmountingcapability,strongsurgewithstand,highreliability. | FORMOSAFormosa MS 美麗微半導(dǎo)體美麗微半導(dǎo)體股份有限公司 | FORMOSA | ||
100V/100mASURFACEMOUNTSWITCHINGDIODE Features: ●Designedformountingonsmallsurface ●Highspeedswitching ●Highmountingcapability,strongsurgewithstand,highreliability | CYSTEKECCystech Electonics Corp. 全宇昕科技全宇昕科技股份有限公司 | CYSTEKEC | ||
75V/150mASURFACEMOUNTSWITCHINGDIODE Features: ●Designedformountingonsmallsurface ●Extremelythin/leadlesspackage ●Highmountingcapability,strongsurgewithstand,highreliability | CYSTEKECCystech Electonics Corp. 全宇昕科技全宇昕科技股份有限公司 | CYSTEKEC | ||
PowerTransformers-StandardEDual115V | CT Central Technologies | CT | ||
PowerTransformers-StandardESingle115V | CT Central Technologies | CT | ||
VersaKrimp??ParallelSplicefor8AWGWire | MOLEX4Molex Electronics Ltd. 莫仕 | MOLEX4 |
詳細(xì)參數(shù)
- 型號:
BUZ355
- 制造商:
Infineon Technologies AG
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
INFINEON |
TO-3P |
30216 |
提供BOM表配單TEL:0755-83759919QQ:2355705587杜S |
詢價 | |||
INFINEON/英飛凌 |
17+ |
P-TO218-3-1 |
31518 |
原裝正品 可含稅交易 |
詢價 | ||
Infineon(英飛凌) |
23+ |
- |
7793 |
支持大陸交貨,美金交易。原裝現(xiàn)貨庫存。 |
詢價 | ||
INFINEON/英飛凌 |
24+ |
TO 3P |
160286 |
明嘉萊只做原裝正品現(xiàn)貨 |
詢價 | ||
INFINEON |
24+ |
P-TO218-3-1 |
8866 |
詢價 | |||
XI.M.Z |
16+ |
TO-3P |
10000 |
全新原裝現(xiàn)貨 |
詢價 | ||
inf |
2339+ |
21322 |
公司原廠原裝現(xiàn)貨假一罰十!特價出售!強(qiáng)勢庫存! |
詢價 | |||
infineon |
16+ |
原廠封裝 |
10000 |
全新原裝正品,代理優(yōu)勢渠道供應(yīng),歡迎來電咨詢 |
詢價 | ||
INF |
23+ |
TO-3P |
1 |
詢價 | |||
SIEMENS |
2023+ |
80000 |
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品 |
詢價 |
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