BC53XPAS-Q_SER中文資料安世數(shù)據(jù)手冊PDF規(guī)格書

1. General description

PNP medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D)

leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and

visible and solderable side pads.

2. Features and benefits

? High collector current capability IC and ICM

? Reduced Printed-Circuit Board (PCB) area requirements

? Exposed heat sink for excellent thermal and electrical conductivity

? Two current gain selections

? Leadless very small SMD plastic package with medium power capability

? Suitable for Automatic Optical Inspection (AOI) of solder joint

? Qualified according to AEC-Q101 and recommended for use in automotive applications

3. Applications

? Linear voltage regulators

? Battery driven devices

? MOSFET drivers

? High-side switches

? Power management

? Amplifiers