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AM29F010-90DWC1中文資料超威半導(dǎo)體數(shù)據(jù)手冊(cè)PDF規(guī)格書

AM29F010-90DWC1
廠商型號(hào)

AM29F010-90DWC1

功能描述

1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1

文件大小

56.33 Kbytes

頁(yè)面數(shù)量

8 頁(yè)

生產(chǎn)廠商 Advanced Micro Devices
企業(yè)簡(jiǎn)稱

AMD超威半導(dǎo)體

中文名稱

美國(guó)超威半導(dǎo)體公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-5-14 10:43:00

人工找貨

AM29F010-90DWC1價(jià)格和庫(kù)存,歡迎聯(lián)系客服免費(fèi)人工找貨

AM29F010-90DWC1規(guī)格書詳情

GENERAL DESCRIPTION

The Am29F010 in Known Good Die (KGD) form is a 1 Mbit, 5.0 Volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form.

DISTINCTIVE CHARACTERISTICS

■ Single power supply operation

— 5.0 V ± 10 for read, erase, and program operations

— Simplifies system-level power requirements

■ High performance

— 90 or 120 ns maximum access time

■ Low power consumption

— 30 mA max active read current

— 50 mA max program/erase current

— <25 μA typical standby current

■ Flexible sector architecture

— Eight uniform sectors

— Any combination of sectors can be erased

— Supports full chip erase

■ Sector protection

— Hardware-based feature that disables/reenables program and erase operations in any combination of sectors

— Sector protection/unprotection can be implemented using standard PROM programming equipment

■ Embedded Algorithms

— Embedded Erase algorithm automatically pre-programs and erases the chip or any combination of designated sector

— Embedded Program algorithm automatically programs and verifies data at specified address

■ Minimum 100,000 program/erase cycles guaranteed

■ Compatible with JEDEC standards

— Pinout and software compatible with single-power-supply flash

— Superior inadvertent write protection

■ Data Polling and Toggle Bits

— Provides a software method of detecting program or erase cycle completion

■ Tested to datasheet specifications at temperature

■ Quality and reliability levels equivalent to standard packaged components

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