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89H48H12AG2ZCBLI集成電路(IC)的專(zhuān)用規(guī)格書(shū)PDF中文資料

89H48H12AG2ZCBLI
廠(chǎng)商型號(hào)

89H48H12AG2ZCBLI

參數(shù)屬性

89H48H12AG2ZCBLI 封裝/外殼為1156-BBGA,F(xiàn)CBGA;包裝為托盤(pán);類(lèi)別為集成電路(IC)的專(zhuān)用;89H48H12AG2ZCBLI應(yīng)用范圍:開(kāi)關(guān)接口;產(chǎn)品描述:IC INTFACE SPECIALIZED 1156FCBGA

功能描述

48-Lane 12-Port PCIe? Gen2 System Interconnect Switch

封裝外殼

1156-BBGA,F(xiàn)CBGA

文件大小

656.68 Kbytes

頁(yè)面數(shù)量

60 頁(yè)

生產(chǎn)廠(chǎng)商 Renesas Technology Corp
企業(yè)簡(jiǎn)稱(chēng)

RENESAS瑞薩

中文名稱(chēng)

瑞薩科技有限公司官網(wǎng)

原廠(chǎng)標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠(chǎng)下載

更新時(shí)間

2025-1-16 20:00:00

89H48H12AG2ZCBLI規(guī)格書(shū)詳情

Features

? High Performance Non-Blocking Switch Architecture

– 48-lane 12-port PCIe switch

? Six x8 ports switch ports each of which can bifurcate to two

x4 ports (total of twelve x4 ports)

– Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s

Gen1 operation

– Delivers up to 48 GBps (384 Gbps) of switching capacity

– Supports 128 Bytes to 2 KB maximum payload size

– Low latency cut-through architecture

– Supports one virtual channel and eight traffic classes

? Standards and Compatibility

– PCI Express Base Specification 2.0 compliant

– Implements the following optional PCI Express features

? Advanced Error Reporting (AER) on all ports

? End-to-End CRC (ECRC)

? Access Control Services (ACS)

? Power Budgeting Enhanced Capability

? Device Serial Number Enhanced Capability

? Sub-System ID and Sub-System Vendor ID Capability

? Internal Error Reporting ECN

? Multicast ECN

? VGA and ISA enable

? L0s and L1 ASPM

? ARI ECN

? Port Configurability

– x4 and x8 ports

? Ability to merge adjacent x4 ports to create a x8 port

– Automatic per port link width negotiation (x8 ? x4 ? x2 ? x1)

– Crosslink support

– Automatic lane reversal

– Autonomous and software managed link width and speed control

– Per lane SerDes configuration

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    89H48H12AG2ZCBLI

  • 制造商:

    Renesas Electronics America Inc

  • 類(lèi)別:

    集成電路(IC) > 專(zhuān)用

  • 包裝:

    托盤(pán)

  • 應(yīng)用:

    開(kāi)關(guān)接口

  • 接口:

    PCI Express

  • 電壓 - 供電:

    3.3V

  • 封裝/外殼:

    1156-BBGA,F(xiàn)CBGA

  • 供應(yīng)商器件封裝:

    1156-FCBGA(35x35)

  • 安裝類(lèi)型:

    表面貼裝型

  • 描述:

    IC INTFACE SPECIALIZED 1156FCBGA

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
IDT
24+
NA
58000
全新原廠(chǎng)原裝正品現(xiàn)貨,可提供技術(shù)支持、樣品免費(fèi)!
詢(xún)價(jià)
Renesas/瑞薩
2324+
NA
78920
二十余載金牌老企,研究所優(yōu)秀合供單位,您的原廠(chǎng)窗口
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IDT
23+
BGA
3200
絕對(duì)全新原裝!優(yōu)勢(shì)供貨渠道!特價(jià)!請(qǐng)放心訂購(gòu)!
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RENESAS ELECTRONICS
22+
SMD
518000
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IDT
2021+
320
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IDT
FCBGA676
608900
原包原標(biāo)簽100%進(jìn)口原裝常備現(xiàn)貨!
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IDT
22+
BGA
12245
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IDT
24+
SOP
9000
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23+
NA/
3397
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IDT
2021+
20
100500
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