3-440347-8中文資料MACOM數據手冊PDF規(guī)格書

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm Top and Note Pad Computers. Other markets include: Disk Drives, Printers, Plotters, Copiers, Cellular Phones, and Medical Equipment.

Product Facts

■ Available in ZIF and non-ZIF

■ Available in 0.3, 0.5, 1.0, and 1.25mm Centerlines

■ Available Tin-Lead or Lead Free

■ SMT, Thu-Hole, Vertical and Right-Angle

■ Right-Angle Available Top or Bottom Contact